Detailed Product Description

Copper Weight: 1oz

Tg Value: 180 C

Base Material: FR-4

CCL Brand: ITEQ

Surface Finish: ENIG

Solder Mask: Blue

Layer Count: 10

Via: Tented

Advantages

a) High Tg FR-4 epoxy glass and Prepreg. Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.

b) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃

c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.

d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

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