Detailed Product Description

CCL: SHengyi

Tg Value: 170C

Layer Count: 4 Layers

Copper Weight: 0.5 Oz

PCB Thickness: 0.4mm +/-0.1

Solder Mask: Red

Surface Finish:ENIG

Via: Via In Pad. Tented

Advantages

a) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃

b) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

d) No minimum order quantity. 1-10 pieces are offered for sale.