Layer counts　

　2-32

　Material

　FR-4、High-frequency、Cu-base、Al-base

　Maximum Size

　500mm X1200mm

　Board Outline Tolerance

　±0.05mm

　Board Thickness

　0.20mm--13.00mm

　Thickness Tolerance ( t≥0.8mm)

　±8%

　Thickness Tolerance ( t＜0.8mm)

±0.08mm

　Insulation Layer Thickness

　0.075mm--5.00mm

　Min Line

　0.075mm

　Min Space

　0.075mm

　Outer Copper Thickness

　35um--420um

　Inner Copper Thickness

　17um--420um

　Drill Hole (Mechanical)

　0.15mm--6.35mm

　Finish Hole (Mechanical)

　0.10mm--6.30mm

　Diameter Tolerance (Mechanical)

　0.005mm

　Registration (Mechanical)

　0.0254mm

　Aspect Ratio

　13:1

　Solder Mask Type

　LPI

　Min Soldermask Bridge

　0.08mm

　Min Soldermask Clearance

　0.05mm

　Plug Hole Diameter

　0.25mm--0.60mm

　Impedance Control Tolerance

　±10%

Surface Finish

　HASL,LF-HASL,ENIG,Imm Tin,Imm Ag,OSP,

Gold Finger