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How to improve the high density circuit board
Added:2017-03-07     Views:467

Circuit board factory said circuit board embedded and blind hole structure. This means after several plate, drilling, hole plating etc. to complete, so the precision positioning is very important.

Circuit board factory said that in addition to improve routing number on the surface of the plate, buried and blind and through holes, blind, buried vias technology combining circuit board technology is an important way to improve the circuit board with high density.

General embedded and blind hole is micro hole. Blind hole buried, are "recent" inner interconnection, greatly reducing the quantity of through holes are formed, the isolation plate settings will be greatly reduced, thereby increasing the number of effective routing and layer board interconnection, improves the interconnection of high density.

So, blind, buried vias with multilayer board than conventional allpass hole plate structure, the same size and the same number of layers, the interconnect density increase of at least 3 times, if the technical indicators in the same, circuit board, blind, buried vias combination, its size will be greatly reduced or layers significantly reduced.

Circuit board plant is introduced, the circuit board so printed in appearance device of high density board, applications have been buried and blind hole technique is more and more, not only the appearance of equipment in large computer, communication equipment used in printed circuit board, and is widely used in civil, industrial areas, and even has been used in some thin plate.

Luen Hing Wah circuit is a professional production of rigid circuit board manufacturers, focusing on the Shenzhen circuit board factory, PCB board, LED aluminum plate, aluminum base circuit board, copper substrate and high frequency circuit board manufacturers, the manufacturers of precision manufacturing (single panel, double sided board, multilayer board manufacturers) the top number can reach 26 layer.

 
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